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TFA9896 boosted audio system with adaptive sound maximizer and speaker protection rev. 1 22 december 2016 product short data sheet company public 1 general description the TFA9896 is a high efficiency class-d audio amplifier with a sophisticated speakerboost protection algorithm. it can deliver 2.1 w (rms; thd = 1 %) output power into an 8 ? speaker at a battery voltage of 3.6 v. internal adaptive 6.1 v dc-to-dc conversion boosts the supply rail to provide additional headroom and power output. the supply voltage is only raised when necessary. this arrangement maximizes the output power and power efficiency during audio playback. a safe working environment is provided for the speaker under all operating conditions. the TFA9896 maximizes acoustic output while ensuring diaphragm displacement and voice coil temperature do not exceed their rated limits. this function is based on a speaker box model that operates in all loudspeaker environments (e.g. free air, closed box or vented box). furthermore, advanced signal processing ensures that the quality of the audio signal is never degraded by unwanted clipping or distortion in the amplifier or speaker. the adaptive sound maximizer algorithm uses feedback to accurately calculate both the temperature and the excursion, allowing the TFA9896 to adapt to changes in the acoustic environment. the audio input interface is tdm and can be i 2 s configured. control settings are communicated via an i 2 c-bus interface. the TFA9896 is available in a 30-bump wlcsp (wafer level chip-size package) with a 400 m pitch. 2 features and benefits ? sophisticated speaker-boost and protection algorithm that maximizes speaker performance while protecting the speaker: C fully embedded software, no additional license fee or porting required C total integrated solution that includes dsp, amplifier, dc-to-dc, sensing and more ? adaptive excursion control guarantees that the speaker membrane excursion never exceeds its rated limit ? real-time temperature protection - direct measurement ensures that voice coil temperature never exceeds its rated limit ? environmentally aware - automatically adapts speaker parameters to acoustic and thermal changes including compensation for speaker-box leakage ? output power: 2.1 w (rms) into 8 ? at 3.6 v supply voltage (r l = 8 ?, thd = 1 %) ? low noise (18 v, a-weighted) use case supported for handset call (receiver mode) ? attenuation setting: 0 db to -15 db in 1 db steps ? clip avoidance - dsp algorithm prevents clipping even with sagging supply voltage ? bandwidth extension option to improve low frequency response
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 2 / 22 ? intelligent dc-to-dc converter maximizes audio headroom from any supply level and limits current consumption at low battery voltages ? compatible with standard acoustic echo cancellers (aecs) ? high efficiency and low power dissipation ? wide supply voltage range (fully operational from 2.8 v to 5.5 v) ? tdm audio interface configurable from 2 slots (i 2 s) up to 16 slots ? i 2 c-bus control interface (400 khz) ? dedicated speech mode with speech activity detector ? speaker current and voltage monitoring (via the tdm-bus) for acoustic echo cancellation (aec) at the host ? fully short-circuit proof across the load and to the supply lines ? sample frequencies from 8 khz up to 48 khz supported ? option to route tdm input direct to tdm output to allow a second tdm input slave device to be used in combination with the TFA9896 ? volume control ? low rf susceptibility ? input clock jitter insensitive interface ? thermally protected ? low pop noise' at all mode transitions 3 applications ? mobile phones ? tablets ? portable gaming devices ? portable navigation devices (pnd) ? notebooks/netbooks ? mp3 players and portable media players
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 3 / 22 4 quick reference data table 1. quick reference data symbol parameter conditions min typ max unit v bat battery supply voltage on pin v bat 2.8 - 5.5 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v v dd(io) input/output supply voltage on pin v dd(io) 1.65 1.8 1.95 v on pin v bat and in the dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no output signal) - 1.75 - ma i bat battery supply current on pin v bat and in the dc-to-dc converter coil; power-down mode - - 1 a on pin v ddd ; operating modes; speakerboost protection activated - 17 - ma on pin v ddd ; operating modes; coolflux dsp bypassed - 6 - ma i ddd digital supply current on pin v ddd ; power-down mode; bck = fs = dio = gainio = 0 v - 10 - a i dd(io) input/output supply current on pin v dd(io) ; operating modes; speakerboost protection activated; i 2 s configured tdm - 100 - a p o(rms) rms output power r l = 8 ? - 2.1 - w r l load resistance of speaker 3.2 8 - ? 5 ordering information table 2. ordering information package type number name description version TFA9896 uk TFA9896 buk [1] wlcsp30 wafer level chip-size package; 30 bumps; 2.06 2.72 0.50 mm sot1443-3 [1] TFA9896 buk with backside coating
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 4 / 22 6 block diagram a a a - 0 2 4 3 6 2 i 2 c i n t e r - face vol t a g e and current s e n s e regi sters speaker- boost protecti o n a l g o r i t h m (cool f l u x dsp) adapt i v e dc- t o - d c c o n v e r t e r t f a 9 8 9 6 irq m a x o u t p u t 0 d b f s / - 6 d b f s c u r r e n t s e n s e v o l t a g e s e n s e / a e c aec g a i n o c h 2 c h 1 g a i n i manager/ rgu bat s e n s e p r o t e c t i o n : o t p ovp uvp ocp a t t e n u a t i o n - 1 5 d b t o 0 d b , 1 d b / s t e p gndp out b out a v d d p gndb bst i n b v b a t v d d ( i o ) v d d d ads2 ads1 scl sda int f s bck dio gainio rst t e m p s e n s e cgu pll tdm mtp cli pper pwm r c v r c v class- d audi o ampli f i e r hpf ram rom gndd test1 t e s t 2 t e s t 3 figure 1. block diagram 7 pinning information 7.1 pinning 1 2 3 f 4 5 c b a aaa-011965 bump a1 index area e d sda bck f s gainio 2 3 4 5 ads1 int ads2 test3 test2 gndb gndp gndd gndd gndd scl 1 a b v ddd c test1 d gndb e v dd(io) bst aaa-01 1966 v ddp inb f gndd dio rst v b a t outb gndd gndd out a bottom view showing a1 marking bump mapping figure 2. bump configuration
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 5 / 22 7.2 pin description table 3. pinning symbol pin type description scl a1 i i 2 c-bus clock input sda a2 i/o i 2 c-bus data input/output bck a3 i digital audio bit clock fs a4 i word select or frame sync gainio a5 i/o digital audio i/o; also used as gain sync for stereo v dd(io) b1 p digital i/o supply ads1 b2 i address select 1 gndd b3 p digital ground int b4 o interrupt output configurable as push pull or open drain output dio b5 i/o digital audio io also used as i 2 s input v ddd c1 p digital core supply voltage ads2 c2 i address select 2 gndd c3 p digital ground test3 c4 i test signal input 3; for test purposes only, connect to pcb ground rst c5 i reset input test1 d1 i test signal input 1; for test purposes only, connect to pcb ground test2 d2 i test signal input 2; for test purposes only, connect to pcb ground gndd d3 p digital ground gndd d4 p digital ground v bat d5 i battery supply sense input gndb e1 p dc-to-dc booster ground gndb e2 p dc-to-dc booster ground gndd e3 p digital ground gndp e4 p class-d power ground gndd e5 p digital ground inb f1 p dc-to-dc booster input bst f2 p dc-to-dc booster output outa f3 o non-inverting output v ddp f4 p class-d power supply outb f5 o inverting output
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 6 / 22 8 functional description the TFA9896 is a highly efficient mono bridge tied load (btl) class-d audio amplifier with a sophisticated speakerboost protection algorithm. figure 1 is a block diagram of the TFA9896. the device contains two tdm input/output channels. the number of slots and number of bits per slot can be configured for each tdm channel and the channel can be configured as input or output. typically, one tdm channel is configured as a standard i2s input while the other tdm channel is used for stereo sync, where gain information is transferred between the devices. it is also possible to output current sense and voltage sense information on the tdm interface, which can be processed by the audio host. the speakerboost protection algorithm, running on a coolflux digital signal processor (dsp) core, maximizes the acoustical output of the speaker while limiting membrane excursion and voice coil temperature to a safe level. the mechanical protection implemented guarantees that speaker membrane excursion never exceeds its rated limit, to an accuracy of 10 %. thermal protection guarantees that the voice coil temperature never exceeds its rated limit, to an accuracy of 10 c. furthermore, advanced signal processing ensures the audio quality remains acceptable at all times. the protection algorithm implements an adaptive loudspeaker model that is used to predict the extent of membrane excursion. the model is continuously updated to ensure that the protection scheme remains effective even when speaker parameter values change or the acoustic enclosure is modified. the speakerboost protection algorithm boosts the output sound pressure level within given mechanical, thermal and quality limits. an optional bandwidth extension mode extends the low frequency response up to a predefined limit before maximizing the output level. this mode is suitable for listening to high quality music in quiet environments. the frequency response of the TFA9896 can be modified via ten fully programmable cascaded second-order biquad filters. the first two biquads are processed with 48-bit double precision; biquads 3 to 8 are processed with 24-bit single precision. a battery supply safeguard mechanism can be configured to reduce the gain at low battery voltage levels to limit battery current. the output volume can be controlled by the speakerboost protection algorithm or by the host application (external). in the latter case, the boost features of the speakerboost protection algorithm must be disabled to avoid neutralizing external volume control. the speakerboost protection algorithm output is converted into two pulse width modulated (pwm) signals which are then injected into the class-d audio amplifier. the 3- level pwm scheme supports filterless speaker drive. the adaptive dc-to-dc converter boosts the battery supply voltage in line with the output of the speakerboost protection algorithm. it switches to follower mode (v bst = v bat ; no boost) when the audio output voltage is lower than the battery voltage.
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 7 / 22 8.1 protection mechanisms the following protection circuits are included in the TFA9896: ? overtemperature protection (otp) ? overvoltage protection (ovp) ? undervoltage protection (uvp) ? overcurrent protection (ocp) the reaction of the device to fault conditions differs depending on the protection circuit involved. the status of these protection circuits can be monitored via the relevant status bits in the system status register, which can be configured to generate interrupts. 8.1.1 overtemperature protection (otp) otp prevents heat damage to the TFA9896 . it is triggered when the junction temperature exceeds t act(th_prot) . the output stages are set floating. otp is cleared automatically via an internal timer (approximately 200 ms), after which the output stages start to operate normally again. the overtemperature status can be monitored via the i 2 c-bus. 8.1.2 supply voltage protection (uvp and ovp) if v bat drops below the undervoltage protection threshold, v p(uvp) , uvp is activated, setting the outputs floating. the system is restarted approximately 200 ms after the supply voltage rises above v p(uvp) again. if the power supply voltage (v ddp ) rises above the overvoltage protection threshold, v p(ovp) , ovp is activated, setting the booster to follower mode. the power stages are re-enabled as soon as the supply voltage drops below v p(ovp) again. the system will be restarted after approximately 200 ms. the undervoltage and overvoltage status can be monitored via the i 2 c-bus. 8.1.3 overcurrent protection (ocp) ocp detects a short circuit across the load or between one of the amplifier outputs and one of the supply lines. if the output current exceeds the overcurrent protection threshold (i o(ocp) ), it is limited to i o(ocp) while the amplifier outputs are switching (the amplifier is not powered down completely). the amplifier can distinguish between an impedance drop at the loudspeaker and a low-ohmic short circuit across the load or to one of the supply lines. the impedance threshold depends on which supply voltage is being used: ? in the event of a short circuit across the load or a short to one of the supply lines, the audio amplifier is switched off completely. it will try to restart again after approximately 200 ms at a sample rate, f s , of 48 khz. if the short-circuit condition is still present after this time, this cycle will be repeated. average dissipation is low because of the short duty cycle. ? the same protection mechanism is activated in the event of an impedance drop (e.g. due to dynamic behavior of the loudspeaker). the maximum output current is again limited to i o(ocp) , but the amplifier does not switch off completely (preventing audio holes from occurring). the result is a clipped output signal without artifacts.
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 8 / 22 9 limiting values table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit pin inb -0.3 +7.3 v v x voltage on pin x pins gainio, dio, bck, fs, int, scl, sda, ads1, ads2 and rst -0.3 +1.95 v v bat battery supply voltage on pin vbat -0.3 +6 v v ddp power supply voltage on pin v ddp -0.3 +7.3 v v ddd digital supply voltage on pin v ddd -0.3 +1.95 v v dd(io) input/output supply voltage on pin v dd(io) -0.3 +1.95 v t j junction temperature - +150 c t stg storage temperature -55 +150 c t amb ambient temperature -40 +85 c according to human body model (hbm) -2 +2 kv v esd electrostatic discharge voltage according to charge device model (cdm) -500 +500 v 10 thermal characteristics table 5. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient 4-layer application board positioned vertically in free air; dimensions: 30 19 1.6 mm; natural convection; copper coverage one each layer > 95 %; copper thickness outer/ inner layer 35 m 60 k/w
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 9 / 22 11 characteristics 11.1 dc characteristics table 6. dc characteristics all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp = v bst = 6.1 v; l bst = 1 h [1] ; r l = 8 ? [1] ; l l = 44 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit v bat battery supply voltage on pin v bat 2.8 - 5.5 v v ddp power supply voltage on pin v ddp 2.8 - 6.2 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v v dd(io) input/output supply voltage on pin v dd(io) 1.65 1.8 1.95 v on pin v bat and in the dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no output signal) - 1.75 - ma i bat battery supply current on pin v bat and in the dc-to-dc converter coil; power-down mode - - 1 a on pin v ddd ; operating modes; speakerboost protection activated - 17 - ma on pin v ddd ; operating modes; coolflux dsp bypassed - 6 - ma i ddd digital supply current on pin v ddd ; power-down mode; bck = fs = dio = gainio = 0 v - 10 - a i dd(io) input/output supply current on pin v dd(io) ; operating modes; speakerboost protection activated; i 2 s configured tdm - 100 - a pins bck, fs, dio, gainio, reset, ads1, ads2, scl, sda v ih high-level input voltage 0.7v dd(io) - 1.95 v v il low-level input voltage - - 0.3v dd(io) v c i input capacitance [2] - - 3 pf i li input leakage current 1.8 v on input pin - - 0.1 a pins dio, gainio, int v oh high-level output voltage - v dd(io) - 0.4 - - v i li input leakage current 1.8 v on input pin - - 0.1 a pin sda: open-drain output v ol low-level output voltage i ol = 4 ma - - 400 mv pins outa, outb r dson drain-source on-state resistance v ddp = 6.1 v - 200 - m?
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 10 / 22 symbol parameter conditions min typ max unit protection t act(th_prot) thermal protection activation temperature 130 - 150 c v p(ovp) overvoltage protection supply voltage protection on v ddp 6.2 - 6.5 v v p(uvp) undervoltage protection supply voltage protection on v bat 2.5 - 2.8 v i o(ocp) overcurrent protection output current 2.0 - - a dc-to-dc converter v o(bst) output voltage on pin bst dcvo2 = 111; boost mode 6.0 6.1 6.2 v [1] l bst = boot converter inductance; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; value is guaranteed by design and checked during product validation.
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 11 / 22 11.2 ac characteristics table 7. ac characteristics all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp = v bst = 6.1 v; l bst = 1 h [1] ; r l = 8 ? [1] ; l l = 44 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit amplifier thd+n = 1 %; rcv = 0 r l = 4 ?; v bat = 4.0 v - 3.2 - w r l = 8 ? - 2.1 - w thd+n = 10 %; rcv = 0 r l = 4 ?; v bat = 4.0 v - 4 - w r l = 8 ? - 2.55 - w p o(rms) rms output power thd+n = 1 %; rcv = 1 - 0.68 - w r l load resistance of speaker 3.2 8 - ? |v o(offset) | output offset voltage absolute value - - 1 mv ? po output power efficiency including dc-to-dc converter; p o(rms) = 2.1 w; v bat = 4.0 v [2] - 83 - % thd+n total harmonic distortion-plus- noise p o(rms) = 100 mw; r l = 8 ?; l l = 44 h [2] - 0.03 0.1 % a-weighted; datai1 = datai2 = 0 v coolflux dsp disabled and bypassed - 27 - v coolflux dsp enabled [2] - 30 - v v n(o) output noise voltage receiver mode; v ddp 4.3 v - 18 - v v o = 4.5 v (peak); a-weighted coolflux dsp disabled and bypassed - 103 - db s/n signal-to-noise ratio coolflux dsp enabled [2] - 100 - db psrr power supply rejection ratio v ripple = 200 mv (rms); f ripple = 217 hz - 90 - db current-sensing performances/n s/n signal-to-noise ratio i o = 1.2 a (peak); a-weighted - 75 - db i sense(acc) sense current accuracy i o = 0.5 a (peak) -3 - +3 % b bandwidth [2] - - 3 khz timing pll locked on bck (ipll = 0) f s = 32 khz to 48 khz - - 2 ms pll locked on fs (ipll = 1) t d(on) turn-on delay time f s = 48 khz - - 6 ms t d(off) turn-off delay time - - 10 s t d(mute_off) mute off delay time - 1 - ms
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 12 / 22 symbol parameter conditions min typ max unit t d(soft_mute) soft mute delay time - 12 - ms coolflux bypassed f s = 8 khz - - 3.5 ms f s = 48 khz - - 600 s speakerboost protection mode, t lookahead = 2 ms f s = 8 khz - - 25 ms t pd propagation delay f s = 48 khz - - 4 ms [1] l bst = boot converter inductance; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; value is guaranteed by design and checked during product validation. 12 application diagrams l 2 c + - speaker 1 . 8 v sda bst c bst 22 f 100 nf c vddd 10 f 1 nf c vba t 10 f l bst 1 h v ddp out a outb a 5 b 4 c 5 f 5 f 3 f 4 f 2 c 1 d 5 f 1 v d d ( i o ) v b a t i n b v d d d b 1 b 5 a 3 a 4 a 1 a 2 t e s t 3 t e s t 2 t e s t 1 g n d d g n d p g n d b a d s 2 a d s 1 scl f s bck dio audio host gainio t f a 9 8 9 6 int rst c 4 d 2 d 1 b 3 c 3 d 3 d 4 e 3 e 5 e 4 c 2 b 2 e 1 e 2 + - aaa-024363 figure 3. typical mono application (simplified)
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 13 / 22 l 2 c + - speaker 1 . 8 v sda bst c bst 22 f c vddd 10 f 1 nf 1 nf c vba t 10 f l bst 1 h v ddp out a outb a 5 c 5 b 4 f 5 f 3 f 4 f 2 c 1 d 5 f 1 v d d ( i o ) v b a t i n b v d d d b 1 b 5 a 3 a 4 a 1 a 2 t e s t 3 t e s t 2 t e s t 1 g n d d g n d p g n d b a d s 2 a d s 1 scl f s bck dio audio host gainio t f a 9 8 9 6 rst int c 4 d 2 d 1 b 3 c 3 d 3 d 4 e 3 e 5 e 4 c 2 b 2 e 1 e 2 + - + - speaker aaa-024364 1 . 8 v sda bst c bst 22 f c vddd 10 f c vba t 10 f l bst 1 h v ddp out a outb a 5 c 5 b 4 f 5 f 3 f 4 f 2 c 1 d 5 f 1 v d d ( i o ) a d s 2 v b a t i n b v d d d b 1 c 2 b 5 a 3 a 4 a 1 a 2 t e s t 3 t e s t 2 t e s t 1 g n d d g n d p g n d b a d s 1 scl f s bck dio gainio t f a 9 8 9 6 rst int c 4 d 2 d 1 b 3 c 3 d 3 d 4 e 3 e 5 e 4 b 2 e 1 e 2 + - 100 nf 100 nf figure 4. typical stereo application (simplified)
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 14 / 22 13 package outline references outline version european projection issue date iec jedec jeita sot1443-1 sot1443-1_po 16-01-25 16-06-01 unit m m max nom min 0.54 0.23 0.28 2.75 2.09 2.0 0.05 0.03 a dimensions (mm are the original dimensions) wlcsp30: wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm sot1443-1 a 1 a 2 0.325 b d e e y e 1 1.6 e 2 v 0.02 w 0.23 z d 1 0.49 z d 2 0.23 z e 1 0.23 z e 2 0.20 0.26 2.72 2.06 0.4 0.300 0.17 0.50 0.46 0.24 2.69 2.03 0.275 x detail x a 2 a 1 a b a e d ball a1 index area ball a1 index area c y 5 4 3 2 1 f e d c b a a c b ? v c ? w b z e 1 e 1 e z d 1 z d 2 z e 2 e 2 e 0 scale 2 mm figure 5. package outline TFA9896 uk (wlcsp30)
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 15 / 22 references outline version european projection issue date iec jedec jeita sot1443-3 sot1443-3_po 15-03-13 16-01-25 unit m m max nom min 0.565 2.75 2.09 2.0 0.05 0.03 a dimensions (mm are the original dimensions) wlcsp30: wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included) sot1443-3 a 1 a 2 b d e e y e 1 1.6 e 2 v 0.02 w 0.23 z d 1 0.49 z d 2 0.23 z e 1 0.23 z e 2 0.20 0.26 2.72 2.06 0.4 0.33 0.525 0.485 2.69 2.03 x detail x a 2 a 1 a b a e d ball a1 index area ball a1 index area c y 5 4 3 2 1 f e d c b a a c b ? v c ? w b z e 1 e 1 e z d 1 z d 2 z e 2 e 2 e 0 scale 2 mm note: backside coating 25 m figure 6. package outline TFA9896 buk (wlcsp30)
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 16 / 22 14 soldering of wlcsp packages 14.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 wafer level chip scale package and in application note an10365 surface mount reflow soldering description . wave soldering is not suitable for this package. all nxp wlcsp packages are lead-free. 14.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 14.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 1) than a snpb process, thus reducing the process window ? solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with table 8 . table 8. lead-free process (from j-std-020d) package reflow temperature (c) volume (mm 3 ) package thickness (mm) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 1.5 260 250 245 > 2.5 250 245 245 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 7 .
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 17 / 22 001aac844 t e m p e r a t u r e t i m e m i n i m u m peak t e m p e r a t u r e = m i n i m um soldering temperature m a x i m u m p e a k t e m p e r a t u r e = m s l l i m i t , d a m age l e v e l peak t e m p e r a t u r e msl: moisture sensitivity level figure 7. temperature profiles for large and small components for further information on temperature profiles, refer to application note an10365 surface mount reflow soldering description . 14.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 14.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 14.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again.
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 18 / 22 device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/ or underfill removed. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 surface mount reflow soldering description . 14.3.4 cleaning cleaning can be done after reflow soldering.
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 19 / 22 15 revision history table 9. revision history document id release date data sheet status change notice supersedes TFA9896 v.1.0 20161222 product data sheet - -
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 20 / 22 16 legal information 16.1 data sheet status document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objective specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer, unless nxp semiconductors and customer have explicitly agreed otherwise in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customers sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customers applications and products planned, as well as for the planned application and use of customers third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customers applications or products, or the application or use by customers third party customer(s). customer is responsible for doing all necessary testing for the customers applications and products using nxp semiconductors products in order to avoid a default of the applications and the products or of the application or use by customers third party customer(s). nxp does not accept any liability in this respect. limiting values stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of nxp semiconductors products by customer. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection TFA9896 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2016. all rights reserved. product short data sheet rev. 1 22 december 2016 company public 21 / 22 quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. non-automotive qualified products unless this data sheet expressly states that this specific nxp semiconductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non- automotive qualified products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond nxp semiconductors standard warranty and nxp semiconductors product specifications. translations a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. i 2 c-bus logo is a trademark of nxp semiconductors n.v.
nxp semiconductors TFA9896 boosted audio system with adaptive sound maximizer and speaker protection please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'legal information'. ? nxp semiconductors n.v. 2016. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 22 december 2016 contents 1 general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 quick reference data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 pinning information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 protection mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1.1 overtemperature protection (otp) . . . . . . . . . . . . . . . . . . . 7 8.1.2 supply voltage protection (uvp and ovp) . . . . . . . . 7 8.1.3 overcurrent protection (ocp) . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11.2 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 application diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 soldering of wlcsp packages . . . . . . . . . . . . . . . . . . . . . . . . 16 14.1 introduction to soldering wlcsp packages . . . . . 16 14.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 16 legal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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